? semiconductor components industries, llc, 2014 july, 2014 ? rev. 4 1 publication order number: mbr130lsft1/d mbr130lsft1g surface mount schottky power rectifier plastic sod?123 package this device uses the schottky barrier principle with a large area metal?to?silicon power diode. ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. this package also provides an easy to work with alternative to leadless 34 package style. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac?dc and dc?dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? guardring for stress protection ? low forward voltage ? 125 c operating junction temperature ? epoxy meets ul 94 v?0 ? package designed for optimal automated board assembly ? esd ratings: machine model, c human body model, 3b ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free and are rohs compliant mechanical characteristics ? reel options: mbr130lsft1g = 3,000 per 7 in reel/8 mm tape ? device marking: l3l ? polarity designator: cathode band ? weight: 11.7 mg (approximately) ? case: epoxy, molded ? lead finish: 100% matte sn (tin) ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements marking diagram l3l = specific device code m = date code = pb?free package http://onsemi.com sod?123fl case 498 schottky barrier rectifier 1.0 amperes, 30 volts device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbr130lsft1g sod?123fl (pb?free) 3000/tape & ree l l3lm NRVB130LSFT1G sod?123fl (pb?free) 3000/tape & ree l (note: microdot may be in either location)
mbr130lsft1g http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (at rated v r , t l = 117 c) i o 1.0 a peak repetitive forward current (at rated v r , square wave, 100 khz, t l = 110 c) i frm 2.0 a non?repetitive peak surge current (non?repetitive peak surge current, halfwave, single phase, 60 hz) i fsm 40 a storage temperature t stg ?55 to 150 c operating junction temperature t j ?55 to 125 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s thermal characteristics thermal resistance, junction?to?lead (note 1) thermal resistance, junction?to?lead (note 2) thermal resistance, junction?to?ambient (note 1) thermal resistance, junction?to?ambient (note 2) r tjl r tjl r tja r tja 26 21 325 82 c/w stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. mounted with minimum recommended pad size, pc board fr4. 2. mounted with 1 in. copper pad (cu area 700 mm 2 ). electrical characteristics maximum instantaneous forward voltage (note 3) v f t j = 25 c t j = 100 c v (i f = 0.1 a) (i f = 0.7 a) (i f = 1.0 a) 0.29 0.36 0.38 0.18 0.27 0.30 maximum instantaneous reverse current (note 3) i r t j = 25 c t j = 100 c ma (v r = 30 v) 1.0 25 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 3. pulse test: pulse width 250 s, duty cycle 2%.
mbr130lsft1g http://onsemi.com 3 typical characteristics figure 1. typical forward voltage figure 2. maximum forward voltage figure 3. typical reverse current figure 4. maximum reverse current 10 1 0.1 v f , instantaneous forward voltage (volts) 0.10 0.30 0.50 t j = 125 c t j = ?55 c t j = 25 c i f , instantaneous forward current (amps) v r , reverse voltage (volts) 100e?3 10e?3 10e?6 100e?6 30 20 10 0 i r , reverse current (amps) 100e?9 t j = 125 c 0.20 0.40 0.80 t j = 100 c 10 1 0.1 v f , maximum instantaneous forward voltage (volts) 0.10 0.30 0.50 t j = 125 c t j = ?55 c t j = 25 c i f , instantaneous forward current (amps) 0.20 0.40 0.7 0 t j = 100 c 0.60 1e?3 1e?6 10e?9 1e?9 t j = ?55 c t j = 25 c t j = 100 c v r , reverse voltage (volts) 100e?3 10e?3 10e?6 100e?6 3 0 20 10 0 i r , maximum reverse current (amps) t j = 125 c 1e?3 1e+0 t j = ?55 c t j = 25 c t j = 100 c figure 5. current derating 25 45 85 65 0 1.0 i o , average forward current (amps) t l , lead temperature ( c) figure 6. forward power dissipation 0.2 0.6 0.8 1.2 0 0.4 1 0.6 0 0.3 i o , average forward current (amps) p fo , average power dissipation (watts) 0.2 0.4 0.6 0.8 1.8 1.2 1.4 1.6 square wave dc i pk /i o = 20 1.4 1. 8 1.6 0.1 0.2 0.5 0.4 105 145 125 i pk /i o = 10 i pk /i o = 5 i pk /i o = freq = 20 khz dc square wave i pk /i o = i pk /i o = 5 i pk /i o = 10 i pk /i o = 20 0.60 0.70
mbr130lsft1g http://onsemi.com 4 typical characteristics figure 7. capacitance figure 8. typical operating temperature derating v r , reverse voltage (volts) 30 25 20 15 10 5 0 10 1000 c, capacitance (pf) v r , dc reverse voltage (volts) 14 12 10 8 6 2 0 115 105 95 85 75 65 70 125 t j , derated operating temperature ( c) 20 t j = 25 c 18 16 r ja = 25.6 c/w r ja = 400 c/w r ja = 130 c/w r ja = 324.9 c/w r ja = 235 c/w 100 110 100 90 80 120 4 r(t), transient thermal resistance figure 9. thermal response 100 0 0.1 0.00001 t 1 , time (sec) 1000 1 0.0001 0.001 0.01 1 10 100 0.000001 0.1 10 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 ja = 321.8 c/w test type > min pad < die size 38x38 @ 75% mils d = 0.5 single pulse 0.2 0.1 0.05 0.01
mbr130lsft1g http://onsemi.com 5 package dimensions sod?123lf case 498 issue d notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold flash. 4. dimensions d and j are to be measured on flat section of the lead: between 0.10 and 0.25 mm from the lead tip. d e b a a1 l c polarity indicator optional as needed *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 0.90 0.95 0.98 0.035 inches a1 0.00 0.05 0.10 0.000 b 0.70 0.90 1.10 0.028 c 0.10 0.15 0.20 0.004 d 1.50 1.65 1.80 0.059 e 2.50 2.70 2.90 0.098 l 0.55 0.75 0.95 0.022 0.037 0.039 0.002 0.004 0.035 0.043 0.006 0.008 0.065 0.071 0.106 0.114 0.030 0.037 nom max 3.40 3.60 3.80 0.134 0.142 0.150 h e ? ? 0 8 0 8 top view bottom view side view h e 2x 2x end view recommended dimensions: millimeters 1.25 2x 4.20 1.22 2x 12 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mbr130lsft1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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